Formation of Circuit Pattern on Liquid-Crystalline Polymer Film by Electroless Copper Plating

摘要

Liquid-crystalline polymer (LCP) films were treated with N_2 plasma in order to improve adhesion with metal film. By N_2 plasma treatment, hydrophilic groups such as NH, COOH and OH were introduced into LCP film and the surface of the film was roughened slightly. After N_2 plasma treatment, a copper film was deposited on the LCP by electroless plating method. The circuit pattern of copper film with 0.5mm (line) and 0.3mm (space) intervals was fabricated on the LCP film.