MICROWAVE IMAGING OF TWO-DIMENSIONAL DIELECTRIC CYLINDERS WITH A MULTISCALED FREQUENCY HOPPING APPROACH

摘要

A multiscaled multifrequency method for inverse profiling of 2D dielectric cylinders is presented. The inverse problem is solved at all frequency hops using a multiscale scheme: the problem is solved at a coarse resolution where it is more stable, and this solution is used as a starting estimate for solving the problem at progressively increasing scales. Multiscaling reduces the risk of the solution getting trapped in a local minimum with respect to the deterministic optimization method employed for the inverse-scattering problem Thus, better initial estimates are provided for the iterations at higher frequencies. Testing the strategy on synthetic multifrequency data provides promising results.