LTCC broadband deep embedded interconnects (DEI) with application for embedded bandpass filter

摘要

Careful design of via transitions intended for use in practical microwave applications is needed to realize the advantages of low-temperature co-fired ceramic (LTCC), such as highly integrated buried passive circuits. Grounded coplanar waveguide (GCPW) to asymmetrical stripline vertical interconnects is optimized for thick LTCC substrate. The focus is to develop a vertical transition through thick substrate supporting deep embedded interconnects (DEI). The measured results demonstrate vertical transitions with good performance up to 20 GHz. Embedded LTCC bandpass filter with such vertical transition has been demonstrated with an insertion loss of 2.2 dB and return loss better than -20 dB at 16.2 GHz.