THREE-POLE CROSS-COUPLED SUBSTRATE-INTEGRATED WAVEGUIDE BANDPASS FILTERS BASED ON PCB PROCESS AND MULTILAYER LTCC TECHNOLOGY

摘要

This letter presents the design, implementation and experiment of planar and multilayer three-pole cross-coupled bandpass filters realized by substrate-integrated waveguide (SIW). The two three-pole filters centered at 10 GHz with one transmission zero are simulated by using full-wave electromagnetic (EM) simulator. Then they are fabricated with printed circuit board (PCB) process and with multilayer low-temperature co-fired ceramic (LTCC) technology, respectively. By the comparison between the two filters, it is easily seen that the multilayer SIW filter based on LTCC technology occupies a very small area while obtaining good performance. The measured results coincide with the simulated results very well and show the superiority of multilayer LTCC technology.