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首页> 外文期刊>Microscopy >Ultrathin sectioning with DUV-pulsed laser ablation: development of a laser ablation nano tome.
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Ultrathin sectioning with DUV-pulsed laser ablation: development of a laser ablation nano tome.

机译:具有DUV脉冲激光烧蚀的超薄切片:激光烧蚀纳米切片的开发。

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摘要

The electrically automated ultrathin sectioning apparatus, which has been developed in recent years, can produce consecutive ultrathin sections with a diamond knife and a gallium ion beam. These newly developed apparatuses, however, have several shortcomings, such as the limited block cutting area, thermal damage to the sample by the focused ion beam and a sample electronic charge. To overcome these faults and for easier scanning electron microscopy three-dimensional fine structural reconstruction, we have developed a new cutting method using a deep ultraviolet laser, which we have named the 'LANTome (Light Ablation Nanotome)'. Using this method, we confirmed the widening of sectioning areas, shortening of the sectioning time, automatic smoothing of rough surfaces, no sample electronic charge and minimal heat effects on the sample tissue, such as thermal denaturation.
机译:近年来开发的电动超薄切片设备可以用金刚石刀和镓离子束连续生产超薄切片。然而,这些新开发的设备具有一些缺点,例如有限的块切割区域,聚焦的离子束对样品的热损伤以及样品的电荷。为了克服这些缺陷并简化电子显微镜的三维精细结构重建,我们开发了一种使用深紫外激光的新切割方法,我们将其命名为“ LANTome(光消融纳米切片机)”。使用这种方法,我们确认了切片区域的扩大,切片时间的缩短,粗糙表面的自动平滑,无样品电荷以及对样品组织的最小热效应(例如热变性)。

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