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Effect of nitrogen doping on piezoresistive properties of a-Si_xC_y thin film strain gauges

机译:氮掺杂对a-Si_xC_y薄膜应变计压阻性能的影响

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摘要

In this study, the effect of nitrogen doping on piezoresistive properties of non-stoichiometric amorphous silicon carbide (a-Si_xC_y) thin-film strain gauges was investigated. The films were prepared by plasma-enhanced chemical vapor deposition (PECVD) and the strain gauges were patterned by fabrication processes like conventional photolithography, metallization and reactive ion etching (RIE). The structure of the strain gauges consists of a a-Si_xC_y thin-film resistor with one Ti/Au electrical contact at each extreme of the resistor. In order to determine the piezoresistive properties, each strain gauge type was bonded near the clamped edge of a stainless steel cantilever beam and on the free edge calibrated weights were applied. The influence of the temperature on piezoresistive properties also was evaluated through the temperature coefficient of resistance (TCR) measurements from room temperature up to 250℃. It was observed that nitrogen doping increased the piezoresistive coefficient and TCR of a-Si_xC_y thin film strain gauges.
机译:在这项研究中,研究了氮掺杂对非化学计量的非晶碳化硅(a-Si_xC_y)薄膜应变仪的压阻特性的影响。通过等离子体增强化学气相沉积(PECVD)制备薄膜,并通过常规光刻,金属化和反应离子刻蚀(RIE)等制造工艺对应变仪进行构图。应变仪的结构由一个a-Si_xC_y薄膜电阻器组成,该电阻器的每个极值端都有一个Ti / Au电触点。为了确定压阻特性,将每种应变仪类型粘结在不锈钢悬臂梁的夹紧边缘附近,并在自由边缘上施加校准砝码。还通过从室温到250℃的电阻温度系数(TCR)测量来评估温度对压阻特性的影响。观察到氮掺杂增加了a-Si_xC_y薄膜应变仪的压阻系数和TCR。

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