THEORETICAL AND TECHNOLOGICAL ASPECTS REGARDING THE CAPITALIZATION OF THE COPPER SLURRIES, FROM COPPER ELECTROLITICAL COVERING LINES

Romanita Teodorescu; Mihaela Uimanu

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THEORETICAL AND TECHNOLOGICAL ASPECTS REGARDING THE CAPITALIZATION OF THE COPPER SLURRIES, FROM COPPER ELECTROLITICAL COVERING LINES

机译：从铜电解覆盖线的角度出发，有关铜浆的容量化的理论和技术方面

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The technological phases and the optimal working conditions are presented in the paper, in order to recover the copper, existing in copper slurries with 3-5 percent additional elements, from electrolitical covering lines, in order to reduce the environmental impact.

机译：本文介绍了技术阶段和最佳工作条件，目的是从电解覆盖线中回收存在于铜浆中的铜（含3-5％的其他元素），以减少对环境的影响。

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《Metalurgia》 |1996年第1期|共3页
作者
Romanita Teodorescu; Mihaela Uimanu;
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正文语种 eng
中图分类冶金工业;
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1. THEORETICAL AND TECHNOLOGICAL ASPECTS REGARDING THE CAPITALIZATION OF THE COPPER SLURRIES, FROM COPPER ELECTROLITICAL COVERING LINES [J] . Romanita Teodorescu, Mihaela Uimanu Metalurgia . 1996,第1期

机译：从铜电解覆盖线的角度出发，有关铜浆的容量化的理论和技术方面
2. A technological manufacturing scheme of copper-powder and of copper coated iron-powder, out of copper scale [J] . LEZANSKI J., MOLNAR F. Rudy i Metale Niezelazne . 2002,第3期

机译：铜垢以外的铜粉和覆铜铁粉的技术制造方案
3. THEORETICAL STUDIES OF ORGANOMETALLIC COMPOUNDS .21. COPPER-SUBSTITUTED ETHANES AS A MODEL FOR COPPER-ACETYLENE INTERACTIONS ON THE METAL SURFACE - QUANTUM MECHANICAL STUDY OF THE STRUCTURE AND BONDING OF COPPER-ACETYLENE AND COPPER-ETHYLENE COMPOUND [J] . Bohme M., Frenking G., Wagener T. Journal of Organometallic Chemistry . 1996,第1a2期

机译：有机化合物的理论研究.21。铜取代的乙炔作为金属表面上铜-乙炔相互作用的模型-铜-乙炔与铜-乙烯化合物的结构键合的量子力学研究
4. ELECTROCHEMICAL ASPECTS OF COPPER CHEMICAL MECHANICAL PLANARIZATION (CMP) IN PEROXIDE BASED SLURRIES [C] . D. Starosvetsky, E. Abelev, Y. Ein-Eli International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing . 2004

机译：基于过氧化物浆料的铜化学机械平坦化（CMP）的电化学方面
5. The effects of chemistry on the colloidal behavior of alumina slurries and copper nanohardness for copper chemical mechanical planarization [D] . Ihnfeldt, Robin Veronica 2008

机译：化学对氧化铝浆料的胶体行为和铜化学机械平坦化的铜纳米硬度的影响
6. The binding of copper ions to copper-free bovine superoxide dismutase. Kinetic aspects. [O] . A Rigo, P Viglino, M Bonori, 1978

机译：铜离子与无铜牛超氧化物歧化酶的结合。动力学方面。
7. Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents [O] . Shantanu Tripathi, Fiona M. Doyle, David A. Dornfeld 2009

机译：CMP浆料成分铜CMP铜钝化动力学的基本机制
8. Partial Report Covering Physical Property Characteristics of Copper-Chromium Combinations in Mo-Gun Steels [R] . Mann, H. C. 1939

机译：在钼钢炮铜铬组合的部分报告中有关物理性能特点

THEORETICAL AND TECHNOLOGICAL ASPECTS REGARDING THE CAPITALIZATION OF THE COPPER SLURRIES, FROM COPPER ELECTROLITICAL COVERING LINES

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