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首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >The Effect of Grain Size on the Ambient Temperature Creep Deformation Behavior of a Beta Ti-14.8 V Alloy
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The Effect of Grain Size on the Ambient Temperature Creep Deformation Behavior of a Beta Ti-14.8 V Alloy

机译:晶粒尺寸对Beta Ti-14.8 V合金环境温度蠕变变形行为的影响

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摘要

The effect of grain size in the range of 18 to 350 mum on the ambient-temperature creep behavior of a metastable beta Ti-14.8 pct V alloy was investigated at a stress level of 95 pct yield stress. The main modes of deformation were found to be stress-induced plate (SIP) formation and slip. In the 350-mum grain-size material, the plates were found to nucleate and grow with time, thereby contributing to the ambient-temperature creep strain. The extent of SIP formation and growth were found to decrease with decreasing grain size, i.e., creep strain was found to decrease with decreasing grain size. The SIPs observed during creep were found to be similar to those observed in an earlier investigation during tensile testing, which were reported to be (332)(113) twins.
机译:在屈服应力为95 pct的情况下,研究了18至350μm晶粒尺寸对亚稳态βTi-14.8 pct V合金的环境温度蠕变行为的影响。发现变形的主要模式是应力诱导板(SIP)的形成和滑移。在350微米晶粒大小的材料中,发现板会随着时间而成核并生长,从而导致环境温度蠕变应变。发现SIP形成和生长的程度随晶粒尺寸减小而降低,即,发现蠕变应变随晶粒尺寸减小而减小。发现蠕变期间观察到的SIP与早期测试中在拉伸测试期间观察到的SIP类似,据报道它们是(332)(113)双胞胎。

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