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Corrosion inhibition of copper-phosphorus brazing alloys in tetra-n-butylammonium bromide aerated aqueous solution by benzotriazole

机译:苯并三唑对溴化四正丁基溴化铵充气水溶液中铜磷钎料的腐蚀抑制作用

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摘要

The corrosion inhibition behavior of benzotriazole (BTA) on a brazing alloy, CuP in the non-welded and welded conditions in 17 wt% (0.534 mol/L) tetra-nbutylammonium bromide (TBAB) aerated aqueous solution was investigated by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), and scanning electron microscopy/energy dispersive X-ray spectroscopy techniques. The experimental results showed that BTA could protect effectively copper alloys in aqueous TBAB solution. The inhibition efficiency of BTA increased with increasing inhibitor concentration from 0.1 to 6 g/L, attaining efficiencies of up to 96% calculated according to different methodologies. Corrosion current densities were lower after the melting process. Galvanic studies showed that copper behaved as the anode when coupled to its alloys. The addition of BTA caused an increase in charge transfer resistance and a decrease in the capacitance of the double layer. Adsorption of BTA in 17 wt% TBAB solution on the copper alloys' surface was found to obey the Langmuir adsorption isotherm.
机译:通过电势极化,电化学研究了在17 wt%(0.534 mol / L)的四正丁基溴化铵(TBAB)充气水溶液中的非焊接和焊接条件下,苯并三唑(BTA)对铜合金CuP的​​腐蚀抑制行为。阻抗光谱(EIS)和扫描电子显微镜/能量色散X射线光谱技术。实验结果表明,BTA可以有效保护TBAB水溶液中的铜合金。 BTA的抑制效率随着抑制剂浓度从0.1到6 g / L的增加而增加,根据不同方法计算得出的效率高达96%。熔化过程后腐蚀电流密度较低。电学研究表明,铜与铜合金耦合时可作为阳极。 BTA的添加引起电荷转移电阻的增加和双层电容的减小。发现在铜合金表面上,BTA在17 wt%TBAB溶液中的吸附符合Langmuir吸附等温线。

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