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2D or not 2D-Layered Functional (C, N) Materials 'Beyond Silicon and Graphene'

机译:二维或非二维二维功能(C,N)材料“超越硅和石墨烯”

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摘要

Thin layers of the semiconductor silicon are omnipresent in all electronic devices. Ongoing, exponential improvement in size, performance, and cost of a single transistor is predicted to face serious challenges in the near feature. With the era of "postsilicon electronics" on the horizon, researchers are racing to address issues of material security, less energy-intensive manufacturing, and design of device properties. The chemistry of carbon and nitrogen (C, N) provides an attractive avenue toward the modular design of new 2D materials "beyond silicon and graphene."
机译:半导体硅的薄层在所有电子设备中无处不在。预计,单个晶体管的尺寸,性能和成本的不断提高将在附近特性中面临严峻挑战。随着“后硅电子学”时代的到来,研究人员正在竞相解决材料安全性,能耗较低的制造以及器件性能设计的问题。碳和氮(C,N)的化学性质为“超越硅和石墨烯”的新型2D材料的模块化设计提供了诱人的途径。

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