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Effect of Silanol Treatment of Inorganic Filler on Dielectric Properties of Inorganic-Organic Composites

机译:硅烷醇处理无机填料对无机有机复合材料介电性能的影响

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摘要

Improvement of the dielectric properties of inorganic-organic composites with 0-3 connectivity is attempted by silanol treatment of the inorganic filler surface. The inorganic filler has high relative permittivity and low dielectric loss, and is coupled with epoxy resin in the composites. Silanol treatment of the filler is performed by adding a small amount of water to a silane coupling agent, and the dielectric properties of the resultant composite are found to be comparable over a filler content range of 50-80 vol percent to the properties of composites fabricated using filler treated by toluene reflux. On the bash of the relationship between relative permittivity and inorganic filler content, it is shown that the experimentally determined properties of the composites are in good agreement with theoretical values calculated using Nielsen's complex rule.
机译:尝试通过硅烷醇处理无机填料表面来改善具有0-3连通性的无机-有机复合材料的介电性能。无机填料具有高的相对介电常数和低的介电损耗,并且在复合物中与环氧树脂偶联。通过向硅烷偶联剂中加入少量水进行填料的硅烷醇处理,发现所得复合材料的介电性能在50-80体积%的填料含量范围内与所制造复合材料的性能相当使用通过甲苯回流处理的填料。在相对介电常数和无机填料含量之间关系的猛烈冲击上,表明复合材料的实验确定的性能与使用尼尔森复数法则计算的理论值非常吻合。

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