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Thermoelectric Property of Ag-doped ZnSb/Few-Layer-Graphene Composites

机译:Ag掺杂ZnSb /几层石墨烯复合材料的热电性能

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摘要

We have successfully synthesized the composites of Ag-doped zinc antimonide (Ag-ZnSb) and few-layer-graphene (FLG) by high-energy-mechanical milling and spark plasma sintering using Ag-ZnSb ingot and FLG as raw materials. The FLG/Ag-ZnSb shows 22%-reduced lattice thermal conductivity by increased phonon boundary scattering due to embedded FLG. The electrical conductivity of the composites was decreased due to reduced carrier concentration, while the Seebeck coefficient of the composites was increased by electron donating effect of FLG. The maximum figure of merit, ZT, of 0.86 was observed at 630K. The peak ZT temperature in the FLG/Ag-ZnSb cases (similar to 630K) were higher than the pristine Ag-ZnSb compound (similar to 580K) resulting in advantages for the higher temperature power generation.
机译:以Ag-ZnSb锭和FLG为原料,通过高能机械铣削和火花等离子体烧结,成功地合成了掺Ag的锑化锌锌(Ag-ZnSb)和薄层石墨烯(FLG)的复合材料。 FLG / Ag-ZnSb由于嵌入FLG而增加了声子边界散射,因此晶格热导率降低了22%。复合材料的电导率由于载流子浓度的降低而降低,而复合材料的塞贝克系数由于FLG的给电子效应而增加。在630K时观察到最大品质因数ZT为0.86。在FLG / Ag-ZnSb情况下(类似于630K),ZT的峰值温度高于原始的Ag-ZnSb化合物(类似于580K),因此具有较高温度发电的优势。

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