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首页> 外文期刊>European Polymer Journal >Preparation, characterization and dielectric properties of 4,4-diphenylmethane diisocyanate (MDI) based cross-linked polyimide films
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Preparation, characterization and dielectric properties of 4,4-diphenylmethane diisocyanate (MDI) based cross-linked polyimide films

机译:4,4-二苯甲烷二异氰酸酯(MDI)基交联聚酰亚胺薄膜的制备,表征和介电性能

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摘要

Four different types of cross-linked polyimides based on 4,4-diphenylmethane diisocyanate (MDI) were prepared by the reaction of different types of conventional poly(amic acid) intermediates with MDI as a cross-linking agent. Subsequently, they were thermally imidized in order to obtain corresponding cross-linked polyimide structure. The results of FTIR-ATR showed that MDI can effectively react with carboxylic acid groups of PAA to form cross-linked polyimide films. TGA, FTIR-ATR and SEM analyses were carried out for characterization of cross-linked polyimide (CPI) films. Moreover, the electrical properties such as dielectric breakdown strength, dielectric constant, I-V characteristics and loss factor of MDI based cross-linked polyimides have been checked. In addition, some physical properties such as water uptake, adhesion, hardness and solubility properties of the films were investigated.
机译:通过不同类型的常规聚(酰胺酸)中间体与MDI作为交联剂的反应,制备了基于4,4-二苯基甲烷二异氰酸酯(MDI)的四种不同类型的交联聚酰亚胺。随后,将它们热酰亚胺化以获得相应的交联聚酰亚胺结构。 FTIR-ATR的结果表明,MDI可以有效地与PAA的羧酸基反应形成交联的聚酰亚胺薄膜。用TGA,FTIR-ATR和SEM分析来表征交联聚酰亚胺(CPI)薄膜。此外,已经检查了基于MDI的交联聚酰亚胺的电性能,例如介电击穿强度,介电常数,IV特性和损耗因子。另外,还研究了膜的一些物理性质,例如吸水率,粘附性,硬度和溶解性。

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