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首页> 外文期刊>European Polymer Journal >Preparation, thermal properties, morphology, and microstructure of phosphorus-containing epoxy/SiO2 and polyimide/SiO2 nanocomposites
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Preparation, thermal properties, morphology, and microstructure of phosphorus-containing epoxy/SiO2 and polyimide/SiO2 nanocomposites

机译:含磷环氧/ SiO2和聚酰亚胺/ SiO2纳米复合材料的制备,热性能,形貌和微观结构

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摘要

A phosphorus-containing tri-ethoxysilane (dopo-icteos) reacting from the nucleophilic addition reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (dopo) and 3-(trieoxysilyl) isocyanate (icteos) was synthesized. The structure of dopo-icteos was confirmed by H-1, C-13, P-31 NMR and IR spectra. A triethylamine catalyzed mechanism for the dopo-icteos synthesis was proposed and verified by NMR spectra. The phosphorus-containing epoxy/SiO2 and polyimide/SiO2 nanocomposites were prepared from the in-situ curing of diglycidyl ether of bisphenol A (DGEBA)/4,4-diaminodiphenylmethane(DDM)/dopo-icteos, and imidization of poly(amic acid) of pyromellitic dianhydride (PMDA)/4,4'-oxydianiline (ODA)/dopo-icteos, respectively. The microstructure and morphology were investigated by 21 Si NMR, scanning electron microscope (SEM), EDS (Si and P mapping) analysis and atomic force microscope (AFM). The thermal properties, flame retardancy and dielectric properties of the organic-inorganic hybrids were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), limiting oxygen index (LOI), thermal gravimetric analysis (TGA) and dielectric analyzer (DEA). (c) 2007 Elsevier Ltd. All rights reserved.
机译:合成了由9,10-二氢-9-氧杂-10磷菲10氧化物(dopo)和3-(三乙氧基甲硅烷基)异氰酸酯(icteos)的亲核加成反应生成的含磷三乙氧基硅烷(dopo-icteos) 。通过H-1,C-13,P-31 NMR和IR光谱证实了多普替奇的结构。提出了三乙胺催化多-偶合体合成的机理,并通过NMR光谱证实。通过双酚A(DGEBA)/ 4,4-二氨基二苯基甲烷(DDM)/ dopo-icteos的二缩水甘油醚的原位固化和聚(酰胺酸)的酰亚胺化制备含磷的环氧/ SiO2和聚酰亚胺/ SiO2纳米复合材料)均苯四酸二酐(PMDA)/ 4,4'-羟二苯胺(ODA)/ dopo-icteos。通过21 Si NMR,扫描电子显微镜(SEM),EDS(Si和P作图)分析和原子力显微镜(AFM)研究了显微组织和形态。通过差示扫描量热法(DSC),动态力学分析(DMA),极限氧指数(LOI),热重分析(TGA)和介电分析仪(DEA)研究了有机-无机杂化物的热性能,阻燃性和介电性能)。 (c)2007 Elsevier Ltd.保留所有权利。

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