Interphase bonding in organic-inorganic hybrid materials using aminophenyltrimethoxysilane

摘要

Several types of silica and titania-aramid hybrid materials were prepared using a sol-gel process.The aramid chains were prepared by the reaction of a mixture of m- and p-phenylene diamines and terephhaloyl chloride in dimethylacetamide.Addition of different amounts of tetraethoxysilane and tetrapropylorthotitanate in the polymer solution,and their subsequent hydrolysis-condensation yielded silica and titania networks,respectively,in the aramid matrix.The chemical bonding between the organic and inorganic phases was achieved by end-capping the aramid chains with aminophenyltrimethoxysilane.In-situ hydrolysis/condensation of tetraethoxysilane or tetrapropylorthotitanate along with that of aminophenyl-trimethosysilane was carried out to produce silica and titania networks chemically bonded to aramid chains.Thin transparent and tough films containing up to 20 wt% of metal oxides were prepared.The storage and the loss moduli as a function of temperature were measured using dynamic mechanical thermal analysis.A greater shift in the #alpha#-relaxation associated with the glass transition temperature (T_g) was observed in case of chemically bonded ceramers as compared to the unbonded and has been explained in term of greater interaction between the organic and inorganic phases.