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首页> 外文期刊>Electrochemistry communications >Electrocatalytic reduction of nitrite ions by a copper complex attached as SAMs on gold by 'self-induced electroclick': Enhancement of the catalytic rate by surface coverage decrease
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Electrocatalytic reduction of nitrite ions by a copper complex attached as SAMs on gold by 'self-induced electroclick': Enhancement of the catalytic rate by surface coverage decrease

机译:通过“自感应电咔嗒声”将附着在金上的SAM铜配合物对亚硝酸根离子进行电催化还原:通过降低表面覆盖率来提高催化速率

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摘要

A biomimetic copper complex has been attached as SAMs onto an azidoundecanethiol-modified gold electrode by the "self-induced electroclick" procedure. The immobilized complex electrocatalyzes efficiently the reduction of nitrite ions in an acidic medium. The in-situ control of the surface coverage during the grafting process by the electroclick approach has been exploited to rationalize the influence of surface concentration on the electrocatalytic properties of the immobilized Cu complex. The voltammetric analysis shows an enhancement of the catalytic rate when the surface coverage is decreased, as a consequence of steric and electronic effects.
机译:通过“自感应电点击”程序,仿生铜络合物作为SAMs附着在叠氮十一烷硫醇修饰的金电极上。固定的配合物有效地电催化酸性介质中亚硝酸根离子的还原。已经利用电点击方法对接枝过程中的表面覆盖进行了原位控制,以合理化表面浓度对固定化铜配合物电催化性能的影响。伏安分析表明,由于空间和电子效应,表面覆盖率降低时,催化速率会提高。

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