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Pseudo-hexagonal composite twins in pulse electroplated copper

机译:脉冲电镀铜中的伪六边形复合孪晶

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摘要

The microstructure and crystallographic texture of copper electrodeposited onto a graphite substrate were examined by scanning electron microscopy, and electron backscatter diffraction. A high twin fraction of 80% was achieved using a pulsed electrodeposition technique under the current density of 0.5 A/cm ~2. A new twinning cluster, termed in this paper as pseudohexagonal composite twins, was observed in pseudohexagonal grains. The pseudohexagonal composite twins possess the crystallographic feature of a rotation angle of 60° around an axis of 111.
机译:通过扫描电子显微镜和电子背散射衍射检查了电沉积在石墨基底上的铜的微观结构和晶体织构。使用脉冲电沉积技术,在0.5 A / cm〜2的电流密度下,可达到80%的高孪晶分数。在伪六边形晶粒中观察到一个新的孪生簇,在本文中称为伪六边形复合孪晶。伪六边形复合孪晶具有围绕111轴旋转60°的晶体学特征。

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