Corning,Intel Partner for EUV Photomask Substrates

摘要

Corning Inc.says it has created a JDA with Intel to create low thermal expansion glass photomask substrates for extreme ultra violet(EUV)lithography technology in 32-nm node production.The EUV technology will be available in 2009.The companies say EUV lithography allows the use of light 13.5-nm in wavelength to draw smaller transistors.