Copper corrosion in sulphuric acid at heat transfer

摘要

AbstractUnder the conditions of the spontaneous convection from the upper horizontal surface of disk‐type copper electrodes the copper corrosion rate in a solution of 1 N H2SO4+0.001 M K2Cr2O7was measured. The effects of the surface temperature of the corroding metal and the effect of the temperature difference between the surface and the solution were determined. The accelerating effect of the heat transfer is attributed to the additional free flow induced by the temperature gradient. Results can be correlated by the equation Sh = 0.163 (Sc · GRh)0.33, where Sh is the Sherwood number expressing the corrosion rate at the heat transfer, GRhis the combined Grashof number for the pressure effect of concentration and temperature, and Sc is the Schmidt numb