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首页> 外文期刊>journal of applied polymer science >Curing behavior of epoxy resin having hydroxymethyl group and different molecular weight distribution
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Curing behavior of epoxy resin having hydroxymethyl group and different molecular weight distribution

机译:Curing behavior of epoxy resin having hydroxymethyl group and different molecular weight distribution

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Abstracto‐Cresol novolac‐type epoxy resins having hydroxymethyl group were synthesized. These epoxy resins were cured with a mixture of 4,4′‐diaminodiphenylmethane andm‐phenylenediamine (molar ratio, 6:4) as a hardener. Effects of molecular weight distribution of epoxy resins on curing behavior were studied. Curing behavior of epoxy resins with hardener were examined by differential scanning calorimetery (DSC), and cure reaction parameters were obtained. Viscoelastic properties of the cured epoxy resins were studied by dynamic mechanical analyzer. It was found that the lower the average molecular weight of the epoxy resin, that is, the higher the concentration of hydroxymethyl group, the shorter the onset time of exothermal reaction, the higher the rate constant (k), and the lower the activation energy (Ea) were. It was also found that glass transition temperature (Tg) of fully cured epoxy resins was higher than those of fully cured general novolac‐type e

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