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Thermal crosstalk simulation and measurement of linear terahertz detector arrays

机译:线性太赫兹探测器阵列的热串扰模拟和测量

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摘要

Thermal simulation of differently structured linear terahertz detector arrays (TDAs) based on lithium tantalate was performed by finite element analysis (FEA). Simulation results revealed that a relatively simple TDA structure can have good thermal insulation, i.e., low thermal crosstalk effect (TCE), between adjacent pixels, which was thus selected for the real fabrication of TDA sample. Current responsivity (R-i) of the sample for a 2.52 THz source was measured to be 6.66 x 10(-6) A/W and non-uniformity (NU) of R-i was 4.1%, showing good performance of the sample. TCE test result demonstrated that small TCE existed in the sample, which was in good agreement with the simulation results. (C) 2015 Elsevier B.V. All rights reserved.
机译:通过有限元分析(FEA)对基于钽酸锂的不同结构的线性太赫兹检测器阵列(TDA)进行了热仿真。仿真结果表明,相对简单的TDA结构可以在相邻像素之间具有良好的隔热性,即低的热串扰效应(TCE),因此选择该TDA结构进行TDA样品的真实制造。样品对2.52 THz源的电流响应(R-i)测量为6.66 x 10(-6)A / W,R-i的不均匀度(NU)为4.1%,显示了样品的良好性能。 TCE测试结果表明,样品中存在较小的TCE,与模拟结果吻合较好。 (C)2015 Elsevier B.V.保留所有权利。

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