首页> 外文期刊>Journal of Applied Polymer Science >Thermal, mechanical, and dielectric studies on the DGEBA epoxy blends by using liquid oxidized poly(1,2-butadiene) as a reactive component
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Thermal, mechanical, and dielectric studies on the DGEBA epoxy blends by using liquid oxidized poly(1,2-butadiene) as a reactive component

机译:使用液体氧化聚(1,2-丁二烯)作为反应组分对DGEBA环氧树脂共混物进行热学、机械学和介电学研究

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摘要

Liquid oxidized poly(1,2-butadiene) (LOPB) with multi epoxy groups is synthesized to modify diglycidyl end-caped poly(bisphenol A-co-epichlorohydrin) (DGEBA) cured by 4,4'-diaminodiphenyl sulfone (DDS). FTIR spectra shows that DGEBA and LOPB can be effectively cured by DDS, and the epoxide rubber particles are evenly distributed in the composites till their addition up to 20 wt of DGEBA as seen from the scanning electron microscope (SEM). Their decomposition temperatures (Td) increase with the increase in LOPB addition at around 10 wt of DGEBA while the Td for the composite containing 20 wt LOPB of DGEBA is lower than that of the neat epoxy. The addition of LOPB improves their storage moduli and especially these values at temperatures higher above 150 degrees C; all the composites exhibit higher glass transition temperature (T-g) than that of the neat epoxy, and the maximum T-g reaches up to 255 degrees C for the composite containing 15 wt LOPB of DGEBA. The incorporation of LOPB effectively decreases their dielectric constants and the composite with 10 wt LOPB of DGEBA possesses the lowest one. The synergic improvements in their various properties are attributed to the networks formation via covalent linkage between the two phases in these reactive blends. (C) 2017 Wiley Periodicals, Inc.
机译:合成了具有多环氧基团的液体氧化聚(1,2-丁二烯)(LOPB),以改性4,4'-二氨基二苯砜(DDS)固化的二缩水甘油基端盖聚(双酚A-co-环氧氯丙烷)(DGEBA)。傅里叶变换红外光谱显示,DDS可以有效固化DGEBA和LOPB,环氧橡胶颗粒均匀分布在复合材料中,直到从扫描电子显微镜(SEM)中可以看出,它们添加的DGEBA高达20 wt %。其分解温度(Td)随LOPB添加量的增加而增加,DGEBA的含量约为10 wt %,而含有20 wt % LOPB的DGEBA复合材料的Td低于纯环氧树脂的Td。LOPB的添加提高了它们的储能模量,尤其是在高于150摄氏度的温度下;所有复合材料都表现出比纯环氧树脂更高的玻璃化转变温度(T-g),对于含有15 wt % LOPB的DGEBA复合材料,最大T-g可达255°C。LOPB的掺入有效降低了其介电常数,其中LOPB含量为10 wt % DGEBA的复合材料具有最低的介电常数。它们各种性质的协同改善归因于这些反应性共混物中两相之间通过共价键形成的网络。(C) 2017 Wiley Periodicals, Inc.

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