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Sputter-deposited Cu/Cu(O) multilayers exhibiting enhanced strength and tunable modulus

机译:溅射沉积Cu/Cu(O)多层膜具有增强的强度和可调模量

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摘要

By means of brief pauses in radiofrequency (RF) sputter deposition between individual layers, ultrathin copper oxide layers were formed through adsorption in the Cu/Cu multilayers. Their mechanical properties were compared with the Cu/Cu(O) multilayers whose oxide layers were deliberately deposited between copper layers. The mechanical hardness value of the Cu/Cu(O) multilayers approached that of nanostructured copper thin films. The Young’s modulus of the multilayers was tunable, in accordance with the elasticity theories of composites. In addition, the Hall–Petch slope of the RF sputter-deposited Cu monolayers indicated that their theoretical strength approached the shear modulus of copper.
机译:通过射频(RF)溅射沉积在各层之间的短暂停顿,通过吸附在Cu/Cu多层中形成超薄氧化铜层。将其力学性能与Cu/Cu(O)多层膜进行了比较,后者的氧化层被故意沉积在铜层之间。Cu/Cu(O)多层膜的力学硬度值接近纳米结构铜薄膜。根据复合材料的弹性理论,多层膜的杨氏模量是可调的。此外,射频溅射沉积Cu单层的霍尔-佩奇斜率表明,其理论强度接近铜的剪切模量。

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