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首页> 外文期刊>Polymer-Plastics Technology and Engineering >Improved Thermal Conductivity of Silicon Carbide/Carbon Fiber/Epoxy Resin Composites
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Improved Thermal Conductivity of Silicon Carbide/Carbon Fiber/Epoxy Resin Composites

机译:Improved Thermal Conductivity of Silicon Carbide/Carbon Fiber/Epoxy Resin Composites

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摘要

The surface functionalized silicon carbide/carbon fiber (SiC/CF) hybrid fillers were introduced to improve the thermal conductivities and mechanical properties of the epoxy resin composites. Results revealed that, the thermal conductivities of epoxy resin composites were increased with the increasing volume fraction of SiC, and a higher thermal conductivity of 1.226 W/mK could be achieved with 28 vol treated SiC/CF hybrid fillers (25 vol treated SiC+3 vol treated CF), about 6 times higher than that of native epoxy resin (0.202 W/mK). Both the flexural strength and impact strength of the epoxy resin composites increased up to 5vol incorporation, but decreased with the further addition of SiC. However, the electrical conductivity was decreased with the increasing volume fraction of SiC. For a given SiC/CF hybrid fillers loading, the surface functionalized SiC/CF hybrid fillers exhibited a positive effect on the thermal conductivities and mechanical properties of the epoxy resin composites.

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