AbstractThe strength of joints between Teflon FEP (Type A) and 500‐ to 1000‐Å gold layers deposited by evaporation can be greatly increased if the Teflon surface is subjected to electron‐beam bombardment prior to the evaporation process. Typically, joint strengths of about 60 kg/cm2, approaching the bulk strength of Teflon, are obtained for treatments with electron‐beam energies in the range of 5 to 20 keV and intercepted charge densities of about 5 X 10−6C/cm2. This compares with gold–Teflon joint strengths of about 10 kg/cm2for untreated material. The increase in joint strength is believed to be primarily due to crosslinking caused by the electron bombardment. Compared to the other known treatments to improve gold–Teflon joints, the present method has the advantage that the charge‐storage properties of the Teflon are not irreversibly degraded. It is possible, for example, to store charge densities up to 3 X 10−8C/cm2, on 25‐μm films treated with this method, with the same favorable charge‐retention properties and thermally stimulated current characteristics as obtain
展开▼
