Increased breakdown strengths of polypropylene films melt‐extruded from plasma‐treated resin

摘要

AbstractThin (11–36 μm) films formed by melt extruding polypropylene resin after the resin had been briefly exposed to low pressure, low temperature, 96 CF4/4 O2gas plasma, exhibited approximately a 20 increase in dielectric breakdown strength. © 1992 John WileySons,