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Development and characterization of groundnut shell lignin modified phenol formaldehyde wood adhesive

机译:花生壳木质素改性酚醛木胶的研制与表征

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Lignin modified phenol formaldehyde wood adhesives have been prepared by replacing phenol with the groundnut shell lignin (GNSL) at varying weight percentages.The optimization of weight percent incorporation of GNSL was carried out in respect to mechanical properties.It was found that a maximum of up to 50 wt.% of phenol in the phenol formaldehyde (PF) adhesive can be substituted by GNSL to obtain lignin substituted phenol formaldehyde (LSPF) adhesive with improved adhesive and shear strength in comparison with PF adhesive.The adhesive composition having 50 wt.% of phenol substituted by GNSL,termed as LSPF50 showed highest adhesive strength.LSPF50 and PF were further characterized by IR,DSC and TGA.Gel time measured and DSC showed higher rate of curing / hardening in LSPF50 than in PF.Therrno-gravimetric analysis (TGA) suggests C stage curing of LSPF50 adhesive at about 150/160 deg C while for PF at about 160/185 deg C.
机译:木质素改性酚醛木材胶粘剂是通过改变花生壳木质素(GNSL)的重量百分比来替代苯酚而制备的,针对机械性能进行了GNSL掺入重量百分比的优化,发现其最大添加量为可以用GNSL取代苯酚甲醛(PF)粘合剂中50%(重量)的苯酚,从而获得木质素取代的苯酚甲醛(LSPF)粘合剂,与PF粘合剂相比具有改善的粘合性和剪切强度.50%(重量)的粘合剂组合物GNSL取代的苯酚的LSPF50表现出最高的粘合强度.LSPF50和PF通过IR,DSC和TGA进一步表征.LSPF50的胶凝时间和DSC的固化/硬化速率比PF高。热重分析( TGA)建议LSPF50粘合剂在约150/160摄氏度下进行C阶段固化,而对于PF在约160/185摄氏度下进行C阶段固化。

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