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Synthesis of isocyanurate-based imidazole carboxylate as thermal latent curing accelerator for thermosetting epoxy resins

机译:合成异氰脲酸酯基咪唑羧酸酯作为热固性环氧树脂的热潜固化促进剂

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摘要

A novel thermal latent curing accelerator, 1-(2-cyanoethyl)-2-methylimidazole/tris (2-carboxyethyl) isocyanurate adduct (2MICN-T), was successfully synthesized through an acid-base neutralization of tris(2-carboxyethyl)isocyanurate (TCEIC) and 1-(2-cyanoethyl)-2-methylimidazole (2MICN). It was further added into diglycidylether of bisphenol A based epoxy resin/methylhexahydrophthalic anhydride mixture to form one-component curing systems. With the addition of 2 wt of 2MICN-T, the one-component system could be steadily stored for more than 1 month at room temperature, while the shelf life of 2MICN curing system was only 2 days. Nonisothermal differential scanning calorimeter also demonstrated the excellent thermal latency of 2MICN-T in low-temperature region and rapid initiation of the curing reaction when raising temperature. Compared to the cured resins with original 2MICN as accelerator, the resulted thermosets exhibited enhanced glassy storage modulus, glass transition temperature, and thermal stability when 2 wt of 2MICN-T was applied. It was attributed to the chemical incorporation of the isocyanurate moieties with multi carboxyl groups and nitrogen-contained heterocyclic ring, effectively increasing the crosslinking density, chain rigidity, and heat resistance of the cured resin. Thus, it is suggested that 2MICN-T can play both roles as latent curing accelerator and modifier for one-component epoxy compounds, and is particularly recommended for application in electronic packaging fields.
机译:通过酸碱中和三(2-羧乙基)异氰脲酸酯(TCEIC)和1-(2-氰乙基)-2-甲基咪唑(2MICN),成功合成了一种新型热潜固化促进剂1-(2-氰乙基)-2-甲基咪唑/三(2-羧乙基)异氰脲酸酯加合物(2MICN-T)。进一步将其加入到双酚A基环氧树脂/甲基六氢邻苯二甲酸酐混合物的二缩水甘油醚中,形成单组分固化体系。添加2 wt%的2MICN-T后,单组分体系在室温下可稳定储存1个月以上,而2MICN固化体系的保质期仅为2 d。非等温差示扫描量热仪还证明了2MICN-T在低温区具有优异的热潜伏期,并且在升温时固化反应迅速启动。与以原始2MICN为促进剂的固化树脂相比,当使用2 wt%的2MICN-T时,所得热固性塑料表现出增强的玻璃储能模量、玻璃化转变温度和热稳定性。这归因于异氰脲酸酯部分与多羧基和含氮杂环的化学掺入,有效地提高了固化树脂的交联密度、链刚性和耐热性。因此,建议2MICN-T可以同时作为单组分环氧化合物的潜伏固化促进剂和改性剂,特别推荐用于电子封装领域。

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