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首页> 外文期刊>Assembly >How to Use Vacuum-Aided Potting: The Essence of Vacuum Dispensing for High-Voltage Substrates
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How to Use Vacuum-Aided Potting: The Essence of Vacuum Dispensing for High-Voltage Substrates

机译:如何使用真空辅助灌封:高压基板真空分配的本质

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摘要

Common knowledge tells us that corrosion is a major stress factor for unprotected wire coils and enamelled copper wires. Depending on the intended subsequent utilization of such parts also mechanical vibrations, humidity and temperature may have to be taken into account. This is of particular importance when dealing with high-voltage parts and substrates, because the volume resistivity of the dispensing material has significant influence on high-voltage insulation. Of course, simply pouring potting material over a coil does not solve all these problems. The dispensing material or the tiny gaps between the wire coils may contain air trapped within. This significantly reduces high-voltage insulation or ruins it altogether. Therefore, to ensure an impregnation that is completely free of air bubbles, the entire preparation, feeding and metering process must be carried out in a vacuum.
机译:常识告诉我们,腐蚀是不受保护的线圈和漆包铜线的主要应力因素。根据这些部件的预期后续用途,还必须考虑机械振动,湿度和温度。当处理高压零件和基板时,这尤其重要,因为分配材料的体积电阻率对高压绝缘有重大影响。当然,仅将灌封材料倒在线圈上并不能解决所有这些问题。分配材料或线圈之间的微小缝隙可能包含滞留在其中的空气。这会大大降低或完全破坏高压绝缘。因此,为了确保完全没有气泡的浸渍,整个制备,进料和计量过程必须在真空中进行。

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