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Removal of Cu(II) from Aqueous Solutions Using Modified Amberlite XAD-7HP Polymeric Resin as an Adsorbent

机译:使用改性的Amberlite XAD-7HP聚合物树脂作为吸附剂从水溶液中去除Cu(II)

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The removal of Cu(II) from aqueous solutions by using modified Amberlite XAD-7HP resin was investigated. The modified resin was prepared by complete mixing of Amberlite XAD-7HP resin with sodium dioctyl sulphosuccinate (SDOSS-anionic surfactant) and EDTA in an aqueous solution. The effect of contact time, pH, modified resin dosage and initial metal ion concentration on the removal of Cu(II) were studied in a batch process mode. The optimum pH required for maximum removal of Cu(II) was found to be 5. The data were fitted with the Langmuir and Freundlich equations to describe the equilibrium isotherms. The maximum adsorption capacity of Cu(II) on modified resin was found to be 34.87 mg/g. Adsorption kinetics data were modelled using the pseudo-first and pseudo-second-order models. The results indicate that the pseudo-second-order model best describes adsorption kinetic data. The modified resin was regenerated by using 5 % NaCl and used again to remove Cu(II) ions. The efficiency of modified resin was also tested with synthetic industrial wastewater and has considerable adsorption capacity.
机译:研究了使用改性Amberlite XAD-7HP树脂从水溶液中去除Cu(II)的方法。通过将Amberlite XAD-7HP树脂与磺基琥珀酸二辛酯钠(SDOSS-阴离子表面活性剂)和EDTA在水溶液中完全混合来制备改性树脂。以分批方式研究了接触时间,pH,改性树脂用量和初始金属离子浓度对去除Cu(II)的影响。发现最大去除Cu(II)所需的最佳pH为5。将数据与Langmuir和Freundlich方程拟合,以描述平衡等温线。发现Cu(II)在改性树脂上的最大吸附容量为34.87mg / g。吸附动力学数据使用伪一级和伪二级模型进行建模。结果表明,伪二级模型最能描述吸附动力学数据。通过使用5%NaCl再生改性树脂,并再次用于去除Cu(II)离子。还用合成工业废水测试了改性树脂的效率,并具有相当大的吸附能力。

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