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Photothermal behavior of an optical path adhesive used for photonics applications at 1550 nm

机译:用于光子学应用的光路粘合剂在1550 nm处的光热行为

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A theoretical and experimental study of photothermal behavior in a commercially available optical path adhesive is described. Photothermal effects were examined for cw and pulsed laser radiation (~1 μs) at 1550 nm. A fiber-optic backreflection technique was used to measure the thermo-optic glass transition temperature of the adhesive. This transition temperature was then used to calibrate fiber-optic photothermal blooming and backreflection pump-probe experiments. Simple thermal models predict ΔT at 300 mW (cw) to be 65℃ and 53℃ at 100 W (pulsed). Experimental results are in reasonable agreement with theoretical predictions. The characteristic photothermal relaxation time after a 1-μs pulse for optical path adhesives is found to be 166 μs at the end of a fiber where the mode field diameter is 10.5 μm. Photothermally induced temperatures were found to be below the thermal degradation temperature of the adhesive even at powers as high as 1 W (cw) or 100 W (pulse).
机译:描述了可商购的光路粘合剂中光热行为的理论和实验研究。检查了1550 nm处的连续波和脉冲激光辐射(〜1μs)的光热效应。光纤背反射技术用于测量粘合剂的热光学玻璃化转变温度。然后将该转变温度用于校准光纤光热起霜和背反射泵浦探针实验。简单的热模型预测300 mW(cw)下的ΔT为65℃,100 W(脉冲)下为53℃。实验结果与理论预测基本吻合。在模场直径为10.5μm的光纤末端,在经过1μs脉冲后,光路粘合剂的特征光热弛豫时间为166μs。发现即使在高达1 W(cw)或100 W(脉冲)的功率下,光热诱导的温度也低于粘合剂的热降解温度。

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