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机译:基于硅基晶片键合工艺的综述,一种实现Si-CMOS和III-V-on-Si晶片单片集成的方法
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
Low Energy Electronic Systems (LEES) Singapore-MIT Alliance for Research and Technology (SMART) Singapore 138602 Singapore;
material; thin film; integrated circuit;
机译:单片3D集成薄的Si晶片基板粘接和去粘合低于250℃
机译:通过SAB直接对SiC-SiC进行晶圆键合,以实现SiC MEMS与电子器件的单片集成
机译:硅基IC和Ⅲ-V外延层的晶圆级单片混合集成-有源矩阵微型LED微显示器的大规模生产方法
机译:用于3D系统集成的晶圆级氧化物熔合和晶圆减薄开发:用于TSV-last集成的氧化物熔合晶圆键合和晶圆减薄开发
机译:扭曲晶圆键合:一种新技术,可将所有III-V化合物单片集成到(光电)电子设备中。
机译:金膜厚度和表面粗糙度对室温晶圆键合和金-金表面活化键合的晶圆级真空密封的影响
机译:晶圆键合用于si CmOs VLsI电子器件与III-V光电器件的单片集成
机译:用于晶圆键合的晶圆清洗和预粘接模块