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首页> 外文期刊>Journal of industrial and engineering chemistry >Dispersion of surface-modified silica nanoparticles in polyamide-imide (PAI) films for enhanced mechanical and thermal properties
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Dispersion of surface-modified silica nanoparticles in polyamide-imide (PAI) films for enhanced mechanical and thermal properties

机译:表面改性二氧化硅纳米粒子在聚酰胺 - 酰亚胺(PAI)膜中的分散,用于增强机械和热性能

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摘要

Silica nanoparticles modified with aminophenyl group were fabricated through two-step sol-gel process under the weak acidic condition due to fast hydrolysis and condensation rate of 3-aminophenyl trimethoxysilane. The aromatic groups on the surface of silica nanoparticles enhanced their dispersion stability in PAI film, and the amine groups were chemically bound with PAI by opening the cyclic imide through nucleophilic attack on carbonyl groups. The thermal stability and mechanical properties of the silica/PAI nanocomposite films have been improved by increasing the amount of modified silica nanoparticles up to 12 wt.%. Specially elongation showed a significant increase by 42.37%. (C) 2016 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved.
机译:由于3-氨基苯基三甲氧基硅烷的水解和缩合速度快,在弱酸条件下通过两步溶胶-凝胶工艺制备了氨基苯基修饰的二氧化硅纳米颗粒。二氧化硅纳米颗粒表面的芳香基团增强了它们在PAI膜中的分散稳定性,通过对羰基的亲核攻击打开环酰亚胺,胺基与PAI发生化学结合。通过将改性二氧化硅纳米颗粒的含量增加至12 wt.%,二氧化硅/PAI纳米复合薄膜的热稳定性和机械性能得到了改善。特别是伸长率显著提高了42.37%。(C) 2016年,韩国工业和工程化学学会。由爱思唯尔B.V.出版。版权所有。

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