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Bonding of glass microfluidic chips at room temperatures

机译:在室温下粘合玻璃微流控芯片

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A simple, room-temperature bonding process was developed for the fabrication of glass microfluidic chips. Highquality bonding with high yields (>95%) was achieved without the requirement of clean room facilities, programmed high-temperature furnaces, pressurized water sources, adhesives, or pressurizing weights. The plates to be bonded were sequentially prewashed with acetone, detergent, high-flow-rate (10-20 m/s) tap water, and absolute ethyl alcohol and were soaked in concentrated sulfuric acid for 8-12 h. The plates were again washed in high-flow-rate tap water for 5 min and, finally, with demineralized water. The plates were bonded by bringing the cleaned surfaces into close contact under a continuous flow of demineralized water and air-dried at room temperature for more than 3 h.Mis bonding process features simple operation, good smoothness of the plate surface, and high bonding yield. The procedures can be readily applied in any routine laboratory. The bonding strength of glass chips thus produced, measured using a shear force testing procedure, was higher than 6 kg/cm(2). The mechanism for the strong bonding strength is presumably related to the formation of a hydrolyzed layer on the plate surfaces after soaking the substrates in acid or water for extended periods. Microfluidic chips bonded by the above procedure were tested in the CE separation of fluorescein isothiocyanate-labeled amino acids.
机译:开发了一种简单的室温粘合工艺来制造玻璃微流控芯片。无需洁净室设施,程序化的高温炉,加压水源,粘合剂或加压砝码,就可以实现高产量(> 95%)的高质量粘结。依次用丙酮,去污剂,高流速(10-20 m / s)自来水和无水乙醇预清洗要粘结的板,并在浓硫酸中浸泡8-12小时。将板再次在高流速自来水中洗涤5分钟,最后用软化水洗涤。通过在连续的软化水流下使清洁过的表面紧密接触并在室温下风干3小时以上来粘合板。误粘合过程具有操作简单,板表面光滑度高和粘合产量高的特点。 。该程序可以很容易地应用于任何常规实验室。因此,使用剪切力测试程序测得的玻璃碎片的粘结强度高于6 kg / cm(2)。牢固结合强度的机制可能与在将基板长时间浸泡在酸或水中之后在板表面上形成水解层有关。在荧光素异硫氰酸酯标记的氨基酸的CE分离中测试了通过上述程序粘合的微流体芯片。

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