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Nanostructured SiC prepared by ultra low temperature densification using amorphous/nano-crystalline bimodal Si-Al-C powder

机译:使用无定形/纳米结晶双峰Si-Al-C粉末通过超低温度致密化制备的纳米结构SiC

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摘要

Mechanical alloying and spark plasma sintering were used to fabricate dense and nanostructured SiC at 1525 degrees C under 40 MPa pressure. Round-shaped nanopowder (d(50): 108 nm) consisting of amorphous Si-Al-C and beta-SiC crystallites was prepared using high-energy ball-milling. Aluminum was homogeneously distributed in the Si-AlC powder. The addition of Al during the milling process caused the decrement in the 3C-SiC crystallinity and promoted the generation of stacking faults in 3C-SiC. Dense SiC with the grain size of 132 nm was fabricated after a two-step sintering at 1600-1550 degrees C. The Al content in the sintered SiC grain was more than 3 times higher than the reported values. Grain boundary diffusion and lattice diffusion were activated due to the high concentration of Al in the powder.
机译:机械合金化和火花等离子体烧结用于在40MPa压力下在1525℃下制造致密和纳米结构SiC。 使用高能球磨制备由无定形Si-Al-C和β-SiC结晶组成的圆形纳米粉末(D(50):108nm)。 铝在Si-Alc粉末中均匀分布。 在铣削过程中加入Al导致3C-SiC结晶度下降,并促进了3C-SiC中的堆叠故障的产生。 在1600-1550℃的两步烧结后,制造具有132nm的粒径为132nm的致密SiC。烧结SiC晶粒中的Al含量比报道的值高3倍。 由于粉末中的高浓度Al,晶界扩散和晶格扩散被激活。

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