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X-ray LIGA Microfabricated Circuits for a Sub-THz Wave Folded Waveguide Traveling-Wave-Tube Amplifier

机译:用于子THz波形折叠波导行波管放大器的X射线LIGA微纤维电路

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摘要

We report experimental results on the microfabrication of three types of folded waveguide circuits with a high aspect ratio by using a high-energy X-ray LIGA technique. A W-band folded waveguide with a total of 80 periods was designed for a traveling-wave-tube (TWT) amplifier operating at 90 GHz-100 GHz. The measured return loss and insertion loss of the W-band fabricated circuit were-10 dB and 0.42 dB/cm, respectively. A G-band circuit showed a higher insertion loss of 1.57 dB/cm. An additional circuit fabrication for a 850-GHz folded waveguide TWT was also successfully carried out. The broad-wall angle measured with respect to the narrow wall of the rectangular waveguide was very close to 90 degrees, indicating an excellent resolution compared to that of other microfabrication techniques, such as deep reactive ion etching (DRIE) and ultraviolet (UV) lithography, electroplating, and polymer replication (LIGA).
机译:通过使用高能X射线LIGA技术,我们报告了通过高纵横比的三种类型的折叠波导电路的微制造的实验结果。 为总共80个周期的W波段折叠波导设计用于在90GHz-100 GHz的行驶波管(TWT)放大器。 W波段制造电路的测量返回损耗和插入损耗分别为-10dB和0.42dB / cm。 G波段电路显示出1.57dB / cm的较高插入损耗。 还成功地执行了850GHz折叠波导TWT的额外电路制造。 相对于矩形波导的窄壁测量的宽壁角度非常接近90度,与其他微加工技术相比,如深反应离子蚀刻(Drie)和紫外(UV)光刻相比,表示优异的分辨率 ,电镀和聚合物复制(LIGA)。

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