A BAKABLE MICROVALVE WITH A KOVAR-GLASS-SILICON-GLASS STRUCTURE

摘要

A new bakable pneumatic silicon microvalve has been developed by micromachining for advanced semiconductor device fabrication. This microvalve is composed of an anodically bonded glass-silicon-glass structure and it is further bonded to a Kovar alloy block which has stainless steel tubes. The gas dow rate could be controlled from 0.5 sccm to 50 sccm at an inlet pressure of 0.26 kgf cm(-2). This microvalve can be used in the temperature range from 25 to 120 degrees C. [References: 14]