Study on the Reliability of Carbon Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints

摘要

The wettability, microstructure and mechanical properties of multi-walled carbon nanotube (CNT)-reinforced Sn-58Bi composite solder joints were investigated. The results indicate that the wettability of the Sn-58Bi solder is improved and the growth of interfacial intermetallic (IMC) compounds for solder joints is restrained by CNTs. The thickness of the IMC layers is decreased with increasing CNTs concentration. The microstructure of the Sn-58Bi composite solders is refined, the maximum tensile strength and shear strength are obtained by adding the optimum CNTs content about 0.01 wt.%. However, excessive content of CNTs addition can deteriorate the properties. The creep rupture life of Sn-58Bi solder joint and Sn-58Bi-0.01CNTs solder joint is decreased with increasing load, temperature and current density. The average creep rupture life of Sn-58Bi-0.01CNTs composite solder joint is 60% higher than that of the plain solder joint.