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Fabrication and Characterization of NbSe2/Ag Encapsulation and Tribological Properties of Its Correlated Copper-Based Composites

机译:Nbse2 / Ag封装和摩擦学性质的制备与表征其相关铜复合材料的植物学性质

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摘要

The fabrication of NbSe2/Ag is that NbSe2 is encapsulated with a layer of nano-Ag by the chemical reduction method, the main purpose of which is to retain more NbSe2 in the copper matrix by avoiding the direct contact between NbSe2 and copper matrix. The powder metallurgy method is used for the preparation of copper-based composites using NbSe2/Ag filler. The microstructures, physical, and tribological properties of copper-based composites are evaluated in detail. It can be found that copper-based composites with NbSe2/Ag show the increased compactness, decreased hardness, and better tribological properties compared with uncoated NbSe2. Based on a series of experimental results analysis, a dense and continuous tribofilm formed, bonded metallurgically to the worn surface, accounts for the excellent tribological properties.
机译:Nbse2 / Ag的制造是Nbse2通过化学还原方法用一层纳米Ag包封,主要目的是通过避免Nbse2和铜基质之间的直接接触来在铜基中保持更多Nbse2。 粉末冶金方法用于使用NbSe2 / Ag填料制备铜基复合材料。 详细评估铜基复合材料的微观结构,物理和摩擦学性质。 可以发现,与未涂覆的Nbse2相比,具有Nbse2 / Ag的铜基复合材料显示出增加的紧凑性,硬度降低,以及更好的摩擦学特性。 基于一系列的实验结果分析,形成致密和连续的呋喃代酯,冶金粘合到磨损的表面上,占优异的摩擦学特性。

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