首页> 外文期刊>Transactions of the Institute of Metal Finishing: The International Journal for Surface Engineering and Coatings >Copper-rich copper-zinc alloy coatings prepared by electrodeposition from glutamate complex electrolyte: current efficiency, Tafel kinetics and throwing power
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Copper-rich copper-zinc alloy coatings prepared by electrodeposition from glutamate complex electrolyte: current efficiency, Tafel kinetics and throwing power

机译:富含铜铜 - 锌合金涂层通过电沉积来自谷氨酸复合电解质:电流效率,Tafel动力学和投掷力

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摘要

Copper-rich Cu-Zn alloy coatings were successfully codeposited on steel substrates using glutamate-based electrolytes at room temperature. The effect of various proportions of Cu2+ and Zn2+ ions in the electrolyte on the current efficiency and on the metal content in deposited alloy was studied. It was found that the current efficiency was 53-99%, depending on the operating conditions and the bath composition, which could be considered high, in comparison with those of cyanide (75%) and citrate baths (70-80%). On the other hand, the Cu content in the deposit ranged from 20% to 98%. The electrochemical kinetic data confirm that addition of monosodium glutamate (MSG) to the plating bath increases i(o) and decreases the Tafel slope while the transfer coefficient is invariant. The relative invariance of alpha(c), observed for increasing glutamate ion concentrations, suggests that the Cu-Zn alloy electrodeposition pathway is not affected by the presence of glutamate. The data of throwing power, throwing index and Wagner number are consistent with each other.
机译:富含铜的Cu-Zn合金涂层在室温下使用基于谷氨酸的电解质在钢基材上成功编写密码。研究了各种比例的Cu 2 +和Zn2 +离子在电解质上的效果对电流效率和沉积合金中金属含量的影响。结果发现,与氰化物(75%)和柠檬酸浴(70-80%)相比,目前的效率为53-99%。另一方面,沉积物中的Cu含量范围为20%至98%。电化学动力学数据证实,向电镀浴中添加谷氨酸钠(MSG)增加I(O)并降低Tafel斜率,而传递系数是不变的。观察到用于增加谷氨酸离子浓度的α(c)的相对不变性表明Cu-Zn合金电沉积途径不受谷氨酸存在的影响。投掷力量,投掷指数和瓦格纳号的数据彼此一致。

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