Assessment of Thermodynamic Properties of Lead-Free Soldering Co–Sb–Sn, Ag–In–Pd–Sn, and Ni–Cr–Co–Al–Mo–Ti–Cu Alloys

摘要

In the present study, the Chou’s general solution model (GSM) has been used to predict the excess Gibbs enthalpy of the liquid Co–Sb–Sn ternary alloys with three selected sections x ~(Sb)/ x ~(Sn)= 1/3, x ~(Co)/ x ~(Sb)= 1/5, and x ~(Co)/ x ~(Sn)= 1/4, of Ag~(10)–In~(80)–Pd–Sn~(10), Ag~(20)–In~(60)–Pd–Sn~(20), and Ag–In~(40)–Pd~(20)–Sn~(40)quaternary alloys and the excess Gibbs energy of Ni–Cr–Co–Al–Mo–Ti–Cu with seven component alloys with selected sections, namely, x ~(Ni)= x ~(Cu), x ~(Cr)= x ~(Ti), x ~(Co)= x ~(Ti), x ~(Al)= x ~(Ti), x ~(Mo)= rx ~(Ti), x ~(Ti)= (1 – x ~(Cu))/( r + 5), and r = 0.1 at temperatures 1273, 1173, and 2000 K, respectively. However, any information in the literature regarding the application of GSM to the alloys mentioned above could not be found, the other geometric models such as Kohler, Muggianu, and Toop are also included in present calculations. Using standard deviation formula, it is seen that some reasonable agreements exist between the results of the geometric models and those of related experiments.