Electrical and Heat Conduction Properties of Polymerization-Filled Composites Based on Ultra-High-Molecular-Weight Polyethylene and Nano- and Micron-Sized Aluminum Particles

摘要

The electrical and heat conduction properties of polymerization-filled composites based on ultrahigh- molecular-weight polyethylene and differently proportioned mixtures of aluminum micro- and nanoparticles coated with oxide layers of various thicknesses have been studied. The composite composition optimal for producing heat-conductive dielectric materials for heat sinks in electronics has been determined. By analyzing the frequency and concentration dependences of the electrical conductivity of the studied composites and the concentration dependences of their thermal conductivity, conclusions were drawn on the charge-transfer mechanisms and the structure of the clusters of the filler.