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首页> 外文期刊>Russian Chemical Bulletin >Dynamic mechanical properties, thermal and heat resistance of multiblock co-poly(urethane-imide) films with graphene and tungsten disulfide
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Dynamic mechanical properties, thermal and heat resistance of multiblock co-poly(urethane-imide) films with graphene and tungsten disulfide

机译:用石墨烯和钨二硫化物的多嵌段共聚(氨基乙烷-Imide)膜的动态力学性能,热和耐热性

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摘要

Organic-inorganic composites filled with nanoscale graphene and tungsten disulfide particles using thermoelastoplastic multiblock co-poly(urethane-imide)s as polymer matrices were obtained. The matrix polymers were the products of the polycondensation of 1,3-bis-(3 ',4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(aminophenoxy)diphenyl sulfone, and two aliphatic polyesters terminated by 2,4-toluene diisocyanate, namely, polypropylene glycol (M-n = 2300) and poly(ethylene adipate) (M-n = 2700). The weight fraction of aromatic segments in samples of co-poly(urethane-imide)s differed by a factor of two. Obtained composites were investigated by TGA, DSC, and DMA methods.
机译:获得了含有纳米级石墨烯和钨二硫化物颗粒的有机无机复合材料,其作为聚合物基质的热塑料多嵌段共聚(氨基甲酸酰亚胺)S作为聚合物基质。 基质聚合物是1,3-双(3',4-二羧苯氧基)苯二酚,1,4-双(氨基苯氧基)二苯基砜的缩聚的产物,并用2,4-甲苯二异氰酸酯终止的两种脂族聚酯 ,即聚丙二醇(Mn = 2300)和聚(乙烯己二酸酯)(Mn = 2700)。 共聚(氨基甲酸酯-IMIDE)样品中的芳族段的重量分数不同于两倍。 通过TGA,DSC和DMA方法研究获得的复合材料。

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