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Secondary bonding of PMMA micromixer with high-pressure

机译:PMMA微混合器具有高压的二次粘合

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摘要

This paper studies the process to fabricate a micromixer by bonding the PMMA sheets after CO2 laser processing microchannel. It has been widely used in analysis chemical and detection as its low cost. Chemical analysis chips are commonly produced using low-pressure bonding. The bonding strength of the micromixer is improved by secondary bonding with high-pressure, which can meet the requirements of the chemical analysis with higher flowing rate and higher pressure. The effects on the single-layer and multi-layer microchannels are compared with high-pressure and low-pressure bonding. The deformation of the width and height at low pressure and high pressure of the single-layer channel are 12.4 mu m, 23.5 mu m and 17.1 mu m, 54.1 mu m, respectively. The multi-layer channels are 43.44 mu m, 23.7 mu m and 78.1 mu m, 27.7 mu m. The influence on the height of the V-shaped micro channel is greater when the single-layer micromixer is performed with high-pressure bonding, and when multi layer bonding with high-pressure, the effect on the width of the rectangular microchannel is obvious. In the process of secondary bonding and pressurization, the chip position can be appropriately adjusted to avoid deformation caused by uneven force on the chip during manual operation. Since high-pressure bonding has an effect on the shape of the microchannel, different bonding methods can be selected according to different requirements of the chemical analysis chips on microchannel quality and bonding strength.
机译:本文研究了CO2激光加工微通道之后通过粘合PMMA片材来制造微混合物的方法。它已被广泛用于分析化学和检测作为其低成本。化学分析芯片通常使用低压键合产生。通过高压次级粘合改善微混合物的粘合强度,这可以满足具有较高流动速率和更高压力的化学分析的要求。将对单层和多层微通道的影响与高压和低压键合进行比较。单层通道低压和高压下的宽度和高度的变形分别为12.4μm,23.5μm和17.1μm,54.1μm。多层通道43.44亩,23.7μm和78.1μm,27.7μm。当用高压键合进行单层微混纱时,对V形微通道的高度的影响更大,当用高压键合时,当与高压的多层键合时,对矩形微通道的宽度的影响显而易见。在二次键合和加压的过程中,可以适当地调节芯片位置以避免手动操作期间芯片上的不均匀力引起的变形。由于高压粘合具有对微通道的形状的影响,因此可以根据微通道质量和粘合强度的化学分析芯片的不同要求选择不同的粘合方法。

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