Analysis of the Dynamic Diameter of Superthin Diamond Blades in the High Speed and Precison Dicing Process

摘要

During the planar lightwave circuit (PLC) splitter manufacturing process, high precision is essential. Controlling machining precision is extremely difficult during the high-speed-and-precision dicing process, which is empirically related to the rotational speed, static diameter and elastic modulus of diamond dicing blades and other factors. However, the effect of changes in the outer diameter of blades on machining precision has been disregarded in the PLC manufacturing process. In this research, we proposed a dynamic diameter (Dd) for describing changes in a blade's outer diameter during the high-speed machining process. Dd is positively correlated with machining precision. Here, we derived a formula for calculating Dd that is related to the rotational speed, static diameter, elastic modulus, Poisson's ratio, density, cutting length and radial wear rate of diamond dicing blades. Furthermore, a series of experimental Dd values was obtained by changing the rotational speed, static diameter and elastic modulus of diamond dicing blades. These values are highly consistent with the calculated results. Our findings not only provide clues to compensate for diameter during high-speed-and-precision dicing process, but also offer guidelines for a new design route of diamond tools.