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Effect of hypophosphite on electrodeposition of graphite@copper powders

机译:次磷酸盐对石墨@铜粉电沉积的影响

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The effect of sodium hypophosphite (NaH2PO2) on the electrodeposition of copper coated graphite powders (graphite@Cu) was investigated in this paper. The cathodic polarization curves were determined by potentiodynamic scanning method in the electrolyte containing various concentrations of NaH2PO2. Hypophosphite could reduce the overpotential of copper deposited on the graphite particles surface and accelerate electroless copper nuclei generated by the reduction reaction. The applied potential promoted the formation of copper nuclei on the surface of graphite powders. Uniform graphite@Cu powders were fabricated by optimizing the NaH2PO2 concentration in the range of 10-15 g dm~(-3). The residue of NaH2_ PO2 could be depleted to less than 0.25 g dm~(-3) by decomposition on the anode and chemical reduction in the bath during electrodeposition. The effect of hypophosphite on the electrodeposition of graphite@Cu is also discussed.
机译:本文研究了次磷酸钠(NaH2PO2)对电沉积铜包覆石墨粉(graphite @ Cu)的影响。通过电位动力学扫描法在含有各种浓度的NaH2PO2的电解液中测定阴极极化曲线。次磷酸盐可减少沉积在石墨颗粒表面的铜的过电势,并加速还原反应生成的化学铜核。施加的电位促进了在石墨粉末表面上铜核的形成。通过在10-15 g dm〜(-3)范围内优化NaH2PO2的浓度来制备均匀的石墨@Cu粉末。通过在阳极上分解以及在电沉积过程中在槽液中进行化学还原,可以将NaH2_PO2的残留物消耗至小于0.25 g dm〜(-3)。还讨论了次磷酸盐对石墨@铜电沉积的影响。

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