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CORROSION RESISTANCE OF ELECTROLESS Ni-P/Cu/Ni-P MULTILAYER COATINGS

机译:化学镀Ni-P / Cu / Ni-P多层涂层的耐腐蚀性

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Ni-P/Cu/Ni-P multilayer coatings were prepared by deposition of Cu layer between two Ni-P layers. The Cu layer was deposited by metal displacement reaction between Cu2+ and Fe atoms. Corrosion behavior of single-layer Ni-P coatings, double-layer Ni-P/Cu coatings, and three-layer Ni-P/Cu/Ni-P coatings were investigated by electrochemical tests in 3.5% NaCl solution. The three-layer coatings exhibited more positive E-corr and decreased I-corr compared with conventional single-layer Ni-P coatings, which indicated an improved corrosion resistance. The polarization curves of the three-layer coatings were characterized by two passive regions. The improved corrosion resistance was not only attributed to the function of the blocked pores of Cu. The Cu interlayer also acted as a sacrificial layer instead of a barrier in the coatings, which altered the corrosion mechanism and further improved the corrosion resistance of the coatings.
机译:通过在两个Ni-P层之间沉积Cu层来制备Ni-P / Cu / Ni-P多层涂层。 通过Cu 2+和Fe原子之间的金属位移反应沉积Cu层。 通过3.5%NaCl溶液中的电化学试验研究了单层Ni-P涂层,双层Ni-P / Cu涂层和三层Ni-P / Cu / Ni-P涂层的腐蚀行为。 与常规单层Ni-P涂层相比,三层涂层具有更高的E-COR和I-COR减少,这表明了改善的耐腐蚀性。 三层涂层的偏振曲线特征在于两个被动区域。 改善的耐腐蚀性不仅归因于Cu的封闭孔的功能。 Cu层间也用作牺牲层而不是涂层中的屏障,其改变了腐蚀机构并进一步提高了涂层的耐腐蚀性。

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