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首页> 外文期刊>Journal of Applied Polymer Science >Influence of amine-terminated additives on thermal and mechanical properties of diglycidyl ether of bisphenol A (DGEBA) cured epoxy
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Influence of amine-terminated additives on thermal and mechanical properties of diglycidyl ether of bisphenol A (DGEBA) cured epoxy

机译:胺封端添加剂对双酚A(DGEBA)固化环氧树脂的二缩水甘油醚热和力学性能的影响

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The present work accounts for the influence of aromatic amide oligomers on the inherent brittleness of cured epoxy. Aromatic and aliphatic amine-terminated amide oligomers have been prepared by condensation polymerization using isophthaloyl dichloride and two different amines. The oligomers have been characterized using Fourier transform infrared spectroscopy and wide angle X-ray diffraction analysis. Diglycidyl ether of bisphenol A (DGEBA) is cured with a diamine (4,4 '-oxydianiline) by using different weight ratio of oligomers. The FTIR of cured epoxy shows ring opening by the disappearance of oxirane ring peak at 913 cm(-1), whereas X-ray diffraction shows its amorphous phase in the cured state. The thermogravimetric analysis of the resultant composites shows that the thermal stability slightly decreases (467-454 degrees C) with increasing the oligomer content from 5 to 25 wt %, whereas the mechanical parameters (Young's modulus, tensile strength, impact strength, and elongation at break) increase with increase in the oligomer content. DMA shows lower tan delta values for aliphatic amine-terminated oligomers for cured epoxy. Two-phase surface morphology is observed through scanning electron microscopy. Owing to their high mechanical and thermal properties, aromatic amides have observed to greatly influence the mechanical properties of cured epoxy, particularly its brittleness. (c) 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 48404.
机译:本作工作鉴于芳香族酰胺低聚物对固化环氧树脂固有脆性的影响。通过使用脱苯二甲酰二氯化物和两种不同的胺制备芳族和脂族丙胺封端的酰胺低聚物。已经使用傅里叶变换红外光谱和广角X射线衍射分析表征了低聚物。双酚A(DGEBA)的二甘蔗酰醚通过使用寡聚体的不同重量比用二胺(4,4'-氧基苯胺)固化。固化环氧树脂的FTIR表示通过在913cm(-1)的氧化氧烷环峰消失的环开口,而X射线衍射在固化状态下显示其无定形相。所得复合材料的热重分析表明,热稳定性略微降低(467-454℃),随着5至25重量%的增加,而机械参数(杨氏模量,抗拉强度,冲击强度和伸长率断裂)随寡聚物含量的增加而增加。 DMA显示脂族胺封端的低聚物的较低的TAN DELTA值,用于固化环氧树脂。通过扫描电子显微镜观察两相表面形态。由于其高机械和热性能,观察到芳族酰胺大大影响固化环氧树脂的机械性能,特别是其脆性。 (c)2019 Wiley期刊,Inc.J.Phill。聚合物。 SCI。 2019,136,48404。

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