High current carrying and thermal conductive copper-carbon conductors

摘要

The surging demand for miniaturized compact devices has generated the need for new metal conductors with high current carrying ampacity, electric and thermal conductivity. Herein, we report carbon-metal conductors that exhibit a high breakdown current density (39% higher than copper) and electrical conductivity (e.g. 63% higher than that of copper at 363 K) in a broad temperature range. The mechanistic studies of thermal conductivity through first-principle modeling show that the multilayer graphene percolation networks efficiently decrease the electron-phonon coupling in the copper-graphene composites, even if phonon modes are activated at a high temperature. These results imply that the copper-based composites have the potential to be the next generation metal conductor with high electrical and thermal conductivity, as well as excellent current-carrying ampacity. More importantly, the developed composite can be deployed in the ink form, making it possible to be utilized by the microelectronic fabrication process.