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首页> 外文期刊>Journal of Applied Polymer Science >Thermosetting bismaleimide resins generating covalent and multiple hydrogen bonds
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Thermosetting bismaleimide resins generating covalent and multiple hydrogen bonds

机译:产生共价键和多个氢键的热固性双马来酰亚胺树脂

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Prepolymerizations of 4,4'-bismaleimidodiphenylmethane (BMI), diallyl isocyanurate (DAIC), and melamine (ML) at 160-170 degrees C and subsequent compression molding at 200-280 degrees C yielded cured BMI/DAIC/ML resins with feed molar ratios of 4/1/1, 3/1/1, and 2/1/1 (BMI-DAIC-ML411, 311, and 211). Similarly, cured BMI/DAIC 1/1 and BMI/ML 3/1 resins (BMI-DAIC11 and BMI-ML31) were prepared. The FT-IR analysis revealed that the maleimide and allyl groups were almost consumed for all the cured resins, and the hydrogen bonding interaction became stronger with decreasing BMI contents for BMI-DAIC-MLs. Based on the cured structures elucidated from the FT-IR result, the numbers of multiple hydrogen bonds and cross-linking covalent bonds (N-MHB and N-CB), and total cross-linking bond energy (E-TB) were evaluated to be 0, 7.92, and 618 for BMI-DAIC-ML411, 0.71, 7.81, and 627 for BMI-DAICML311, and 0.95 mol kg(-1), 7.61 mol kg(-1), and 617 kcal kg(-1) for BMI-DAIC-ML211, respectively. A higher order of glass transition and 5% weight loss temperatures for BMI-DAIC-MLs was 411> 311> 211 in accordance with a higher order of NCB. BMI-DAIC-MLs displayed a weak tan delta peak at 70-150 degrees C due to dissociation of the hydrogen bonds. The flexural strength and modulus of BMI-DAICML311 were higher than those of BMI-DAIC-ML411 in accordance with the difference of ETB. (c) 2015 Wiley Periodicals, Inc.
机译:将4,4'-双马来酰亚胺二苯基甲烷(BMI),二烯丙基异氰脲酸酯(DAIC)和三聚氰胺(ML)在160-170摄氏度下进行预聚合,然后在200-280摄氏度下进行压缩成型,得到具有进料摩尔比的固化BMI / DAIC / ML树脂比为4/1 / 1、3 / 1/1和2/1/1(BMI-DAIC-ML411、311和211)。类似地,制备固化的BMI / DAIC 1/1和BMI / ML 3/1树脂(BMI-DAIC11和BMI-ML31)。 FT-IR分析表明,所有固化树脂几乎都消耗了马来酰亚胺和烯丙基,并且随着BMI-DAIC-MLs BMI含量的降低,氢键键合作用变得更强。根据FT-IR结果阐明的固化结构,评估多个氢键和交联共价键(N-MHB和N-CB)的数目以及总交联键能(E-TB),对于BMI-DAIC-ML411为0、7.92和618,对于BMI-DAICML311为0.71、7.81和627,以及0.95 mol kg(-1),7.61 mol kg(-1)和617 kcal kg(-1)分别适用于BMI-DAIC-ML211。 BMC-DAIC-ML的玻璃化转变和5%失重温度的更高阶次是411> 311> 211,这与NCB的更高阶次一致。由于氢键的解离,BMI-DAIC-ML在70-150摄氏度下显示出较弱的tanδ峰。根据ETB的不同,BMI-DAICML311的抗弯强度和模量高于BMI-DAIC-ML411。 (c)2015年威利期刊有限公司

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